Bonding the Future | Donghua Material Science Showcased at the 27th International Adhesives and Sealants Expo (ASE CHINA 2024)
Release Date:2024-09-20

On September 19, the 27th International Adhesives and Sealants Expo (ASE CHINA 2024) commenced in Halls N3, N4, and N5 of the Shanghai New International Expo Center. Donghua Material Science proudly showcased its offerings at booth N3801 in Hall N3.

At this year's adhesive expo, Donghua displayed an array of its key adhesive resin products, alongside cationic photoinitiators, cationic thermal initiators and comprehensive downstream application solutions.

Cycloaliphatic epoxy resins boast versatility across numerous adhesive applications, encompassing electronic packaging, display encapsulation, UV-curable adhesives, new energy adhesives, potting compounds, heat-resistant adhesives, and more. At the expo, we tailored a diverse range of resin and curing agent product combinations to cater to specific requirements pertaining to viscosity and temperature resistance.